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Precision Optical Design: Utilizing engineered microlens array technology to optimize beam transmission paths, enabling miniaturization and high-density integration of Optical Circuit Switch (OCS) devices.
Multi-Channel Parallel Processing: Implementing an N×N array structure to achieve simultaneous switching of multiple optical paths, enhancing cross-connect efficiency between heterogeneous network nodes.
High-Precision Alignment Capability: Sub-micron manufacturing processes ensure precise coupling between optical fibers and optical chips, reducing signal loss and ensuring stability in long-distance transmission.
Key Specifications
|
Material |
Fused silica, Silicon |
|
Configuration |
2D Array (lens grid customizable) |
|
Lens Diameter |
0.02 – 1.5mm |
|
Pitch |
127, 250, 500, 750 μm, 1.5 mm, 2 mm, and customized |
|
Type |
Spherical, aspherical |
|
Center Thickness |
0.4 – 3.2mm (Fused silica) 0.25 – 1mm (Silicon) |
|
Accuracy |
Sub-micron |
|
Wavelength Range |
DUV to Mid-IR |
|
Coatings |
Dielectric coating and metallization available |
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